Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.
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All testing occurs inside the chamber, while the cards are exposed to the test humidity. Open the container and suspend two cards inside the chamber so that the spots can be observed from outside the chamber.
J-std0-33b.1 supplier should be consulted. I recommend changes to the following: This can be accomplished by dry pack according to Clause 3. Testing Procedure Place the sealed container of cards into the chamber.
Level 2 parts are still adequately dry. When this option is used, it must be veri? The bags shall be heat sealable.
The cards inside the chamber must be observable from outside the chamber. The body temperature during re? Table lists equivalent derated? Level 1 parts classi? General Considerations for Baking Water clean processes after the?
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The caution label is not required if a bar code label includes the Level 1 classi? Refer to Clause 6 for the baking of populated boards.
After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a Mounted within: Set the chamber for the next humidity and continue in this manner until j-std-033b.11 has been collected for all conditions. When identifying a bake cycle, the maximum exposure temperature and maximum rate of temperature change of components and materials on the subject printed wiring assembly must be considered, and an appropriate time temperature pro? If the actual shelf life has exceeded 12 months, but less than 2 years, from the bag seal date and the humidity indicator card HIC see Clause 5.
The following assumptions were used in calculating Table This document describes the standardized levels of? Hue shall h-std-033b.1 tested using the test method in Appendix A.
Cards with spots that do not indicate dry or wet conditions, per Tableshould be rejected. Therefore, the effect of these materials must be compensated for by baking or, if required, adding additional desiccant in the MBB to ensure the shelf life of the SMD packages.
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Refer to Clause 7 to determine maximum allowable time before rebake would be necessary. It can occur due to misprocessing e. For the purpose of this standard, the bar code label is on the lowest level shipping container and includes information that describes the product e. If a higher bake temperature is required, Jeddec packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the low temperature carriers.
As a minimum, all materials used in medec packing should conform to EIA Examples of temperature sensitive components include organic LEDs, batteries, and electrolytic capacitors. Storage in a dry cabinet may be considered m-std-033b.1 to storage in a dry pack with unlimited shelf life. Table gives conditions for rebake of SMD packages at a user site after the?
If any component on the board has exceeded its?